Teamed Power Architecture
Modern CPU architectures up the ante for motherboard power design by transitioning from deep power saving modes to full load almost instantaneously. Our latest VRM architecture rises to the challenge by utilizing teamed power stages to rapidly swing current, while maintaining exemplary thermal performance.
We became the first manufacturer to implement phase doublers when we shipped the A8N32-SLI Deluxe back in 2005. The board's VRM was lauded for elegantly overcoming the power handling capabilities of components that were available at the time and also reducing voltage ripple. Those benefits lead to phase doublers becoming universally accepted in the industry, and they are still used for similar purposes today.
The MOSFETs within the power stages generate the most heat as they are responsible for voltage conversion and delivery to the CPU from the 12V EPS connector.
However, the current crop of CPUs pack more cores than their predecessors, and the latest instruction sets allow them to crunch computationally dense workloads at an incredible pace. As an added bonus, they also consume less power at idle and can transition between loads states much more quickly. These improvements necessitate a re-evaluation of power design priorities because phase doublers add a propagation delay that hampers transient response.
The teamed architecture allows two power stages to work in tandem to provide more power to the CPU.
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Fortunately, the latest Integrated power components can handle higher currents than the devices of yesteryear, making it possible to implement a simple circuit topology that isn't hamstrung by the processing lag of phase doublers. That's why our X299 motherboards utilize teamed power stages to deliver higher burst current per phase, while maintaining the thermal performance of phase-doubled designs.
Learn more about Thermal Comparison Result
Teamed Solution
Phase-Doubled Solution
Pitting the teamed VRM against a phase-doubled solution results in near identical thermal performance.
The MOSFETs within the power stages generate the most heat as they are responsible for voltage conversion and delivery to the CPU from the 12V EPS connector.
**Mouseover to press play and compare**
Each VRM component serves a specific purpose. PWM controllers and doublers control the circuit, and the power stages do the heavy lifting from an electrical and thermal standpoint. That's why the Encore utilizes 16 Infineon TDA21472 power stages. The TDA21472 sits at the top of Infineon's lineup and features a low RDSON to reduce switching and conduction losses, helping to improve overall thermal headroom.
Dual 8-pin ProCool II power connectors
Two ProCool connectors ensure a snug and reliable connection to the EPS 12V power lines.
Infineon TDA21472 power stage
16 Infineon TDA21472 power stages comprise the Encore VRM, each rated to handle 70 amps.
MicroFine alloy chokes
Each Power stage is accompanied by a high-permeability alloy-core choke rated to handle 45 amps.
10K Japanese-made black metallic capacitors
Input and output filtering is provided by solid-polymer capacitors rated to last thousands of hours at high operating temperatures.
Polymer solid capacitor
To further optimize transient response, we've added 8 SP-capacitors to the power plane. The resulting bulk capacitance results in a 13.8% shallower AC-DC load-line setting compared Rampage VI Omega.
OPTIMEM III DDR4 4266+ MHZ (O.C.)
OptiMem III is a major milestone in our pursuit to create motherboards that offer the most memory overclocking headroom. When applied to the X299 platform, OptiMem III increases frequency margin to the point that the board is no longer a bottleneck. Pair the Extreme Encore with a capable chip and memory kit and achieve frequencies up to DDR4-4300MHz in a 4 or 8-DIMM configuration.
Connectivity
Storage
Four M.2 slots let you fully utilize the Intel VROC and NVMe RAID to achieve ultimate SSD storage speeds.
VROC
The exclusive ROG DIMM.2 module allow you to take advantage of the Intel Virtual RAID on CPU (VROC) feature* by connecting two M.2 drives in RAID configuration. With VROC, your RAID arrays are easily configured to be bootable, and traditional DMI bottlenecks are eliminated.
*Additional purchase of Intel VROC hardware key required for RAID 1, 5 or 10
PCH RAID
Wired directly to the X299 PCH, the two onboard M.2 slots can be used in chipset-based RAID configurations to improve storage performance or provide a layer of redundancy.
USB
USB 3.2 Gen 2x2
Reversible USB 3.2 Gen 2x2 Type-C™ ports provide ultimate flexibility and blazing data-transfer speeds of up to 20 Gbps.
USB 3.2 Gen 2 Front-panel Connectors
Two front-panel USB 3.2 connectors are ready to accommodate a wide variety of devices.
Wi-Fi 6 (AX200)
Onboard Wi-Fi 6 (802.11ax) supports ultrafast network speeds, improved capacity and better performance in dense Wi-Fi environments, providing exceptional online gaming experiences.
10 Gbps Onboard Ethernet
Designed to meet the demanding requirements of power users and content creators, 10 Gbps onboard Ethernet provides a new level of home networking. With up to 10X the bandwidth of standard gigabit Ethernet, you'll enjoy streaming uncompressed 4K UHD videos, and backups and file transfers that are faster than ever before.
Intel Ethernet
ROG Rampage VI Extreme Encore features the latest Intel® Ethernet (I219-V) for faster, smoother gaming. This Intel controller has a natural synergy with Intel processors and chipsets, reducing CPU overhead and offering exceptionally high TCP and UDP throughput – so there's more power for games and other tasks.
* Actual speed varies depending on networking conditions.
** Minimum Category 6 network cables required for 10 Gbps operation. Category 5e cables support up to 5 Gbps.
* Actual speed varies depending on networking conditions.
** Minimum Category 6 network cables required for 10 Gbps operation. Category 5e cables support up to 5 Gbps.
SupremeFX
ROG is renowned for superior onboard audio, and Rampage VI Extreme Encore is no exception. The front-panel headphone output features a SABRE9018Q2C integrated DAC/amp capable of reaching -115dB THD+N to provide playback that conveys all the subtlety and nuances of even the highest-quality audio track. The improved resolution derived from the ESS Hyperstream™ DAC architecture expands the soundstage to give a better sense of positioning. Beyond resolution, the 121dB DNR provides an extremely low noise-floor, further accentuating dynamics and punch. And, when you want to shift priority to musicality, our Sonic Studio software provides an array of EQ options, allowing the sound signature to be tweaked to suit your cans.
> Learn more about ROG audio technology
Led-illuminated audio jacks Makes it easy to find audio jacks — even in the dark.
Creates a perfect balance for top-tier audio clarity capable of –115dB THD
10 DAC channels provide simultaneous 7.1-channel playback, independent 2.0-channel, multiple-stream stereo to front-panel outputs
Unique design allows the codec's impedance-sensing function to be ported with either the front or rear headphone outputs
Fine-quality Japanese-made components that produce a warmer, natural sound with exceptional clarity and fidelity
Led-illuminated audio jacks Makes it easy to find audio jacks — even in the dark.
Creates a perfect balance for top-tier audio clarity capable of –115dB THD
10 DAC channels provide simultaneous 7.1-channel playback, independent 2.0-channel, multiple-stream stereo to front-panel outputs
Unique design allows the codec's impedance-sensing function to be ported with either the front or rear headphone outputs
Fine-quality Japanese-made components that produce a warmer, natural sound with exceptional clarity and fidelity
