ASUS Dual Radeon™ RX 6600
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ASUS Dual Radeon™ RX 6600
型號
ASUS Dual Radeon™ RX 6600
繪圖核心
AMD Radeon™ RX 6600
匯流排規格
PCI Express 4.0
OpenGL
OpenGL®4.6
記憶體形式
8GB GDDR6
GPU 時脈
OC mode : up to 2491 MHz (Boost Clock)/up to 2064 MHz (Game Clock)
Gaming mode : up to 2491 MHz (Boost Clock)/up to 2044 MHz (Game Clock)
Gaming mode : up to 2491 MHz (Boost Clock)/up to 2044 MHz (Game Clock)
Stream Processors
1792
Memory Speed
14 Gbps
Memory Interface
128 位元
解析度
Digital Max Resolution 7680 x 4320
介面
有 x 1 (原生 HDMI2.1)
有 x 3 (原生 DisplayPort 1.4a)
支援HDCP : 有 (2.3)
有 x 3 (原生 DisplayPort 1.4a)
支援HDCP : 有 (2.3)
最多可支援顯示器數量
4
NVlink/ Crossfire Support
有
配件
1 x Collection Card
1 x Speedsetup Manual
1 x Speedsetup Manual
軟體
ASUS GPU Tweak II 與處理器：請由支援網站下載所有軟體。
產品尺寸
243 x 134 x 49 mm
9.6 x 5.3 x 1.9 inches
9.6 x 5.3 x 1.9 inches
Recommended PSU
500W
電源連接器
1 x 8-pin
Slot
2.5 Slot
Note
* Our wattage recommendation is based on a fully overclocked GPU and CPU system configuration. For a more tailored suggestion, please use the “Choose By Wattage” feature on our PSU product page: https://rog.asus.com/event/PSU/ASUS-Power-Supply-Units/index.html
* Crossfire Support for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.
* Crossfire Support for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.