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RX6700XT-12G
型號
RX6700XT-12G
繪圖核心
AMD Radeon RX 6700 XT
匯流排規格
PCI Express 4.0
OpenGL
OpenGL®4.6
記憶體形式
12GB GDDR6
GPU 時脈
OC mode : Up to 2581 MHz (Boost Clock)/Up to 2444 MHz (Game Clock)
Gaming mode : Up to 2581 MHz (Boost Clock)/Up to 2424 MHz (Game Clock)
Gaming mode : Up to 2581 MHz (Boost Clock)/Up to 2424 MHz (Game Clock)
Stream Processors
2560
Memory Speed
16 Gbps
Memory Interface
192-bit
解析度
Digital Max Resolution 7680 x 4320
介面
有 x 1 (原生 HDMI2.1)
有 x 3 (原生 DisplayPort 1.4a)
支援HDCP : 有 (2.3)
有 x 3 (原生 DisplayPort 1.4a)
支援HDCP : 有 (2.3)
最多可支援顯示器數量
4
NVlink/ Crossfire Support
有
配件
1 x ROG Sticker
1 x Speedsetup Manual
1 x Speedsetup Manual
軟體
ASUS GPU Tweak II 與處理器：請由支援網站下載所有軟體。
產品尺寸
26.67 x 11.015 x 3.975 cm
10.5 x 4.337 x 1.565 inches
10.5 x 4.337 x 1.565 inches
Recommended PSU
650W
電源連接器
1 x 6-pin, 1 x 8-pin
Slot
2.0 插槽
Note
* Our wattage recommendation is based on a fully overclocked GPU and CPU system configuration. For a more tailored suggestion, please use the “Choose By Wattage” feature on our PSU product page: https://rog.asus.com/event/PSU/ASUS-Power-Supply-Units/index.html
* Crossfire Support - Yes for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.
* Crossfire Support - Yes for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.