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TUF-RX6900XT-O16G-GAMING
Model
TUF-RX6900XT-O16G-GAMING
Silnik graficzny
AMD Radeon RX 6900 XT
Standard szyny
PCI Express 4.0
OpenGL
OpenGL®4.6
Pamięć wideo
16GB GDDR6
Taktowanie zegara
OC mode : Up to 2340 MHz (Boost Clock)/ Up to 2105 MHz (Game Clock)
Gaming mode : Up to 2310 MHz (Boost Clock)/ Up to 2075 MHz (Game Clock)
Gaming mode : Up to 2310 MHz (Boost Clock)/ Up to 2075 MHz (Game Clock)
Procesory strumieniowe
5120
Szybkość pamięci
16 Gbps
Interfejs pamięci
256-bitowy
Rozdzielczość
Maks. rozdzielczość cyfrowa 7680 x 4320
Interfejsy
Tak x 1 (Native HDMI 2.1)
Tak x 3 (Native DisplayPort 1.4a)
Obsługa HDCP Tak (2.3)
Tak x 3 (Native DisplayPort 1.4a)
Obsługa HDCP Tak (2.3)
Maksymalna obsługa wyświetlacza
4
Obsługa NVlink/ Crossfire
Tak
Akcesoria
1 x TUF certificate of Reliability
1 x Collection card
1 x ASUS ruler
1 x Speedsetup manual
1 x Collection card
1 x ASUS ruler
1 x Speedsetup manual
Oprogramowanie
ASUS GPU Tweak II i sterowniki: pobierz całe oprogramowanie ze strony wsparcia technicznego.
Wymiary
12.6 x 5.52 x 2.28 inch
32 x 14.02 x 5.78 Centimeter
32 x 14.02 x 5.78 Centimeter
Rekomendowana moc zasilacza
850 W
Gniazda zasilania
2 x gniazdo 8-pinowe:
Slot
2,9 gniazda
AURA SYNC
ARGB
Informacja
* Crossfire Support - for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.