ASUS Announces GeForce RTX 3060 Ti Series Graphics Cards
2020/12/01
Five new models deliver the power of NVIDIA® Ampere architecture
and buffed-up designs
TAIPEI, Taiwan, December 1, 2020— ASUS today
announced a new series of graphics cards that will debut with the latest NVIDIA
GeForce RTX 3060 Ti GPU. The series includes five new models: ROG Strix, TUF
Gaming, ASUS Dual, ASUS Dual MINI and ASUS KO GeForce RTX 3060 Ti. These new
graphics cards bring buffed-up cooling, PCBs and power designs to complement
the new NVIDIA Ampere architecture and deliver the latest and greatest in 3D
gaming performance.
NVIDIA
GeForce RTX 3060 Ti GPU
Powered by the NVIDIA Ampere architecture and
the 2nd generation of NVIDIA RTX, the world’s most powerful PC gaming platform
for real-time ray tracing and AI, the GeForce RTX 3060 Ti delivers blistering
1080p and 1440p gameplay.
The RTX 3060 Ti also supports the trifecta of
GeForce gaming innovations too, including performance-accelerating and
IQ-enhancing NVIDIA DLSS technology which is now available in over 25
games; NVIDIA Reflex which reduces system latency (‘input lag’),
making games more responsive, and giving players in competitive multiplayer
titles an extra edge over the opposition; and NVIDIA Broadcast, a suite of audio and video AI enhancements
including virtual backgrounds and noise removal that users can apply to chats,
Skype calls and video meetings. So whether they’re playing traditional PC
titles, powering through creator and
productivity workflows, or
marveling at the latest cutting-edge
ray-traced titles like Cyberpunk 2077, Call of Duty: Black Ops Cold War, Watch Dogs: Legion, and more, the GeForce RTX 3060 Ti delivers
the best possible experience in its class for everyone everywhere.
ROG Strix: Take flight
From top to
bottom, ROG Strix GeForce RTX 3060 Ti graphics cards deliver powerful thermal
designs and are optimized for the dynamic NVIDIA Ampere architecture.
A shroud
with metal accents encompasses a trio of Axial-tech fans that have been tuned
to fulfill specialized roles. The central fan leverages a full-height barrier
ring and 13 fan blades that provide boosted static pressure to drive air
through the heatsink fins and onto the GPU heat spreader. The two fans on the
flanks feature 11 blades each and half-height barrier rings to allow for more
lateral dispersion and to provide better airflow through the cooling array.
Turbulence between fans is reduced due to a reversal of the center fan’s
rotational direction.
A larger
heatsink that fills most of the card’s 2.9-slot footprint was designed to
leverage the increased airflow. To get heat up off the die and into the
heatsink array, MaxContact technology has been utilized to polish the surface
of the heat spreader and improve smoothness at the microscopic level. The extra
flatness allows for better contact with the die for enhanced thermal transfer.
In addition
to an enhanced cooling array, Super Alloy Power II componen