ASUS Dual Radeon™ RX 6600
1 製品中 1 - 1 製品表示
ASUS Dual Radeon™ RX 6600
製品名
ASUS Dual Radeon™ RX 6600
グラフィックスエンジン
AMD Radeon™ RX 6600
バスインターフェース
PCI Express 4.0
OpenGL
OpenGL®4.6
ビデオメモリ
8GB GDDR6
コアクロック
OC mode : up to 2491 MHz (Boost Clock)/up to 2064 MHz (Game Clock)
Gaming mode : up to 2491 MHz (Boost Clock)/up to 2044 MHz (Game Clock)
Gaming mode : up to 2491 MHz (Boost Clock)/up to 2044 MHz (Game Clock)
Stream Processors
1792
メモリスピード
14 Gbps
メモリインターフェース
128-bit
解像度
Digital Max Resolution 7680 x 4320
インターフェース
HDMI 2.1 x 1
Native DisplayPort 1.4a x3
HDCP Support (2.3)
Native DisplayPort 1.4a x3
HDCP Support (2.3)
最大ディスプレイサポート
4
NVlink/ Crossfire サポート
はい
アクセサリ
1 x Collection Card
1 x Speedsetup Manual
1 x Speedsetup Manual
ソフトウェア
ASUS GPU Tweak II &ドライバー:サポートサイトからすべてのソフトウェアをダウンロードしてください。
サイズ
243 x 134 x 49 mm
9.6 x 5.3 x 1.9 inches
9.6 x 5.3 x 1.9 inches
推奨PSU
500W
電源コネクタ
1 x 8-pin
スロット
2.5 Slot
その他
* Our wattage recommendation is based on a fully overclocked GPU and CPU system configuration. For a more tailored suggestion, please use the “Choose By Wattage” feature on our PSU product page: https://rog.asus.com/event/PSU/ASUS-Power-Supply-Units/index.html
* Crossfire Support for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.
* Crossfire Support for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.