ASUS Announces Z10PE-D8 WS

2014/09/18

Cernusco sul Naviglio, 18 settembre 2014 ASUS today announced new workstation motherboard Z10PE-D8 WS based on the Intel® C612 chipset and with dual processor sockets ready for the latest Intel Xeon® processor E5-2600 v3 product families.

With ASUS-exclusive Beat Thermal Chokes II, Driver-MOSFET (Dr. MOS), 12K capacitors and ProCool power connectors, Z10PE-D8 WS is built with premium components for premium power efficiency.

The new Server System Infrastructure Enterprise Electronics Bay (SSI EEB) motherboards have superb storage support, including the ASUS PIKE II (Proprietary I/O Kit Expansion) card and support for PCI Express® (PCIe) 3.0 x4 M.2 (Next-Generation Form Factor, or NGFF) devices of up to 110m (type 22110). They benefit also from the ASUS Q-Code Logger for one-touch easy maintenance with Q-Code and a Dr. Power LED lamp to clearly indicate unusual power statuses.

Ultimate PCI Express 3.0 multi-GPU graphics power with Z10PE-D8 WS

Z10PE-D8 WS is equipped to provide the ultimate workstation graphics power, with support for up to four dual-slot graphics cards. Both 4-Way NVIDIA® GeForce® SLI and AMD® CrossFireX are supported, so Z10PE-D8 WS is an excellent choice for professionals who depend on powerful graphics in areas such as design, modeling and medical research, as well as processing-intensive simulation and rendering applications.

As well, with a total of seven PCIe 3.0 slots, Z10PE-D8 WS offers ample room for RAID cards, PCI Express-based solid-state drives (SSDs), video-capture cards and other high-speed components.

Premium components for premium power efficiency

Z10PE-D8 WS benefit from premium components hand-chosen and carefully arranged by ASUS engineers to provide premium power efficiency. These include an integrated Driver-MOSFET (Dr. MOS) to save space and reduce operating temperatures for more efficient operation, and ASUS-exclusive Beat Thermal Chokes II. The new Beat Thermal Chokes II design delivers greater durability and up to 94% power efficiency under normal operation. A special fin design results in up to 5°C-lower choke temperatures for added stability, further bolstered by use of a highly-conductive gold coating. This translates into minimal-loss power delivery.

ASUS is the world’s first server manufacturer to introduce 12K solid capacitors — and Z10PE-D8 WS have these ultra-resilient components on board. These Japanese-made capacitors are able to withstand up to 12,000 hours of temperatures as high as 105°C, far exceeding everyday demands. And at a typical operating temperature of 65°C, our 12K capacitors have an expected lifespan of 1.2m hours — or well over a century.

Z10PE-D8 WS include ProCool, the ASUS-exclusive reinvented power connector. ProCool differs from traditional power connectors, ensuring an exceptionally close and secure connection with the motherboard. This design is much stronger, and it also benefits power efficiency: the flush connection enables lower impedance and better heat dissipation, allowing cooler operating temperatures.

Flexible fan speed control, flexible storage and easy maintenance

The new Z10PE-D8 WS motherboard offer flexible fan-speed controls, which can be managed manually or automatically. In automatic mode, the motherboard’s highly-accurate temperature sensor detects the CPU’s workload and adjusts the fan speeds accordingly. In manual mode, the administrator is free to decide the fan curve to meet demand

The new Z10PE-D8 WS motherboard offer industry-leading storage flexibility, with a built-in M.2 connector supporting PCIe 3.0 x4 2260 (60mm), 2280 (80mm) and 22110 (110mm) devices, and support for the ASUS PIKE II (Proprietary I/O Kit Expansion) card for high-reliability, enterprise-grade 12Gbit/s Serial Attached SCSI (SAS) devices.

The motherboard also benefit from ASUS Q-Code Logger, an easy-maintenance button that records four-digit port 80 code logs to a flash drive with one touch, so administrators can diagnose problems quickly and easily. Similarly, the conveniently-located Dr. Power LED displays messages to clearly indicate any unusual power statuses.

AVAILABILITY & PRICING

Z10PE-D8 WS will be available worldwide from 8th September 2014. Please contact your local ASUS representative for further information.

SPECIFICATIONS[1]

ASUS Z10PE-D8 WS

CPU socket

Dual Intel® Socket 2011-3 for Xeon® E5-2600 v3 product family

Chipset

Intel C612 PCH

Memory

8 x DIMMs, up to a maximum of 512GB, DDR4 2133MHz

Expansion slots

4 x PCI Express® 3.0 x16 slots (dual at x16/x16; quad at x8/x8/x8/x8)

2 x PCI Express 3.0 x16 slots (at x16 speed)

1 x PCI Express 3.0 x16 slot (at x8 speed)

Graphics (VGA)

ASpeed AST2400 32MB

VGA port (with bracket); maximum resolution 1920 x 1200 at 60Hz

Multi-GPU

NVIDIA® 4-Way SLI Technology and AMD quad-GPU CrossFireX technology supported

Storage connectivity

8 x SATA 6Gbit/s ports with RAID 0,1,5 and 10 support (for Windows only)

2 x SATA Express ports

1 x M.2 Socket 3 (supports type 2260/2280/22110, M-keyed storage devices)

ports)

Networking/LAN

2 x Intel i210-AT Gigabit LAN controllers

USB

ASMedia USB 3.0 controllers:

- 4 x USB 3.0/2.0 ports at mid-board for front-panel support

- 2 x USB 3.0/2.0 ports at back panel

Intel C612 chipset:

- 4 x USB 3.0/2.0 ports (4 ports at back panel)

- 4 x USB 2.0/1.1 ports (2 ports at mid-board, 2 ports at back panel)

Audio

Realtek® ALC1150 8-channel high-definition audio codec

Additional features

Digital eight-phase power to CPU and two-phase power to DRAm; dual front-panel USB 3.0 support; ASUS fanless design; ASUS Q-Code, Q-Shield, Q-Slot and Q-DIMM; ASUS CrashFree BIOS 3, EZ Flash 2, MyLogo 2 and multi-language BIOS; 12K capacitors; ProCool power connector; Dr. Power; Q-Code Logger; USB BIOS Flashback; ASWM Enterprise; ASUS PIKE SAS upgrade kit (optional); ASMB8-iKVM remote-management tool (optional).

Dimensions / form factor

EEB, 12 inches x 13 inches (30.5cm x 33cm)




[1] Specifications, content and product availability are all subject to change without notice and may differ from country to country. Actual performance may vary depending on applications, usage, environment and other factors.