ASUS TUF Gaming Radeon™ RX 6500 XT OC edition 4GB GDDR6

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ASUS TUF Gaming Radeon™ RX 6500 XT OC edition 4GB GDDR6
Modello
ASUS TUF Gaming Radeon™ RX 6500 XT OC edition 4GB GDDR6
Graphic Engine
Radeon RX 6500 XT
Bus Standard
PCI Express 4.0
OpenGL
OpenGL®4.6
Video Memory
4GB GDDR6
Engine Clock
OC mode: up to 2825 MHz(Boost Clock)/ up to 2705 MHz(Game Clock)
Gaming mode: up to 2825 MHz(Boost Clock)/ up to 2685MHz(Game Clock)
Stream Processors
1024
Memory Speed
18 Gbps
Memory Interface
64-bit
Resolution
Digital Max Resolution 7680 x 4320
Interface
Yes x 1 (Native HDMI 2.1)
Yes x 1 (Native DisplayPort 1.4a)
HDCP Support Yes (2.3)
Maximum Display Support
2
NVlink/ Crossfire Support
Accessories
1 x Speedsetup Manual
Software
ASUS GPU Tweak II e Driver: scaricare l’intero software dal sito dedicato all’assistenza.
Dimensions
250 x 147 x 54 mm
9.76 x 5.78 x 2.12 inch
Recommended PSU
500W
Power Connectors
1 x 6-pin
Slot
Slot da 2.7
AURA SYNC
ARGB
Note
* Our wattage recommendation is based on a fully overclocked GPU and CPU system configuration. For a more tailored suggestion, please use the “Choose By Wattage” feature on our PSU product page: https://rog.asus.com/event/PSU/ASUS-Power-Supply-Units/index.html
* All specifications are subject to change without notice. Please check with your supplier for exact offers. Products may not be available in all markets. If you do not use the latest and current specifications of ASUS products, you shall be liable for all loss and damage claimed by third party to ASUS based on false advertising or any other issues caused from using false specifications of ASUS products.
* Crossfire Support for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.