TUF-RX6900XT-O16G-GAMING
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TUF-RX6900XT-O16G-GAMING
Modèle
TUF-RX6900XT-O16G-GAMING
Graphic Engine
AMD Radeon RX 6900 XT
Bus Standard
PCI Express 4.0
OpenGL
OpenGL®4.6
Video Memory
16GB GDDR6
Engine Clock
OC mode : Up to 2340 MHz (Boost Clock)/ Up to 2105 MHz (Game Clock)
Gaming mode : Up to 2310 MHz (Boost Clock)/ Up to 2075 MHz (Game Clock)
Gaming mode : Up to 2310 MHz (Boost Clock)/ Up to 2075 MHz (Game Clock)
Stream Processors
5120
Memory Speed
16 Gbps
Memory Interface
256-bit
Resolution
Digital Max Resolution 7680 x 4320
Interface
Yes x 1 (Native HDMI 2.1)
Oui x 3 (Native DisplayPort 1.4a)
HDCP Support : Oui (2.3)
Oui x 3 (Native DisplayPort 1.4a)
HDCP Support : Oui (2.3)
Maximum Display Support
4
NVlink/ Crossfire Support
Yes
Accessories
1 x TUF certificate of Reliability
1 x Collection card
1 x ASUS ruler
1 x Speedsetup manual
1 x Collection card
1 x ASUS ruler
1 x Speedsetup manual
Software
ASUS GPU Tweak II & Drivers: please download all software from the support site.
Dimensions
12.6 x 5.52 x 2.28 inch
32 x 14.02 x 5.78 Centimeter
32 x 14.02 x 5.78 Centimeter
Recommended PSU
850W
Power Connectors
2 x 8-pin
Slot
2.9 Slot
AURA SYNC
ARGB
Note
* Crossfire Support - for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.