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TUF GAMING Radeon™ RX 6900 XT OC Edition
Modelo
TUF GAMING Radeon™ RX 6900 XT OC Edition
GPU
AMD Radeon RX 6900 XT
Barramento Padrão
PCI Express 4.0
OpenGL
OpenGL®4.6
Memória de Vídeo
16GB GDDR6
Clock
OC mode : Up to 2340 MHz (Boost Clock)/ Up to 2105 MHz (Game Clock)
Gaming mode : Up to 2310 MHz (Boost Clock)/ Up to 2075 MHz (Game Clock)
Gaming mode : Up to 2310 MHz (Boost Clock)/ Up to 2075 MHz (Game Clock)
Stream Processors
5120
Velocidade de Memória
16 Gbps
Interface de Memória
256-bit
Resolução
Resolução Máx Digital 7680 x 4320
Interface
Sim x 1 (HDMI 2.1 nativo)
Sim x 3 (DisplayPort 1.4a nativa)
Suporte HDCP: Sim (2.3)
Sim x 3 (DisplayPort 1.4a nativa)
Suporte HDCP: Sim (2.3)
Suporte Máximo de Telas
4
Suporte NVlink/ Crossfire
Sim
Acessórios
1 x TUF certificate of Reliability
1 x Collection card
1 x ASUS ruler
1 x Speedsetup manual
1 x Collection card
1 x ASUS ruler
1 x Speedsetup manual
Software
ASUS GPU Tweak II e Drivers: baixe todos os softwares no site de suporte.
Dimensões
12.6 x 5.52 x 2.28 inch
32 x 14.02 x 5.78 Centimeter
32 x 14.02 x 5.78 Centimeter
PSU Recomendada
850 W
Conectores de Energia
2 x 8-pinos
Slot
Slot 2.9
AURA SYNC
ARGB
Nota
* Crossfire Support - for DirecX® 12 and Vulkan®
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.
* ‘Game Clock’ is the expected GPU clock when running typical gaming applications, set to typical TGP (Total Graphics Power). Actual individual game clock results may vary.
* ‘Boost Clock’ is the maximum frequency achievable on the GPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads.
